Semiconductor component having encapsulated die stack

Details Semiconductor component having encapsulated die stack Semiconductor component having encapsulated die stack

2006-09-19

2006-09-19

Williams, Alexandero Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE25031, C257SE23042, C257S685000, C257S723000, C257S777000, C257S784000, C257S786000, C257S788000, C257S789000, C257S790000

Reexamination Certificate

active

07109576

ABSTRACT:
A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The first encapsulant has a planar surface for attaching the second die, and can also include locking features for the second die. The component also includes a second encapsulant encapsulating the second die and forming a protective body for the component. A method for fabricating the component includes the steps of attaching the first die to the substrate, forming the first encapsulant on the first die, attaching the second die to the first encapsulant, and forming the second encapsulant on the second die.

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