Semiconductor component and method of manufacture

Details Semiconductor component and method of manufacture Semiconductor component and method of manufacture

2009-01-23

2010-12-14

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S585000, C257S367000, C257SE21384

Reexamination Certificate

active

07851312

ABSTRACT:
A semiconductor component that includes a field plate and a semiconductor device and a method of manufacturing the semiconductor component. A body region is formed in a semiconductor material that has a major surface. A gate trench is formed in the epitaxial layer and a gate structure is formed on the gate trench. A source region is formed adjacent the gate trench and extends from the major surface into the body region and a field plate trench is formed that extends from the major surface of the epitaxial layer through the source and through the body region. A field plate is formed in the field plate trench, wherein the field plate is electrically isolated from the sidewalls of the field plate trench. A source-field plate-body contact is made to the source region, the field plate and the body region. A gate contact is made to the gate region.

REFERENCES:
patent: 6156606 (2000-12-01), Michaelis
patent: 6710403 (2004-03-01), Sapp
patent: 7265398 (2007-09-01), Yu
patent: 2005/0242392 (2005-11-01), Pattanayak et al.
patent: 2006/0060916 (2006-03-01), Girdhar et al.
patent: 2007/0093077 (2007-04-01), Grivna
patent: 2008/0073707 (2008-03-01), Darwish
patent: 2005/053032 (2005-06-01), None
patent: 2005/053032 (2005-06-01), None
patent: 2005/053031 (2005-09-01), None
patent: 2005/053031 (2005-09-01), None
patent: 2005/112128 (2005-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor component and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor component and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component and method of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4167784