Semiconductor circuit arrangement and a method for producing...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257S370000, C257S371000, C257S503000, C257S507000

Reexamination Certificate

active

06852585

ABSTRACT:
A semiconductor circuit arrangement includes a circuit element embedded in a semiconductor substrate of a first conductivity type in an integrated manner and is provided with at least one gate electrode and first and second terminal electrodes. The first terminal electrode includes a well region that is embedded in the semiconductor substrate and is of a second conductivity type which is opposite the first conductivity type. A sub-well region is embedded in the well region of the first terminal electrode and is of the second conductivity type and has a higher doping than said well region. The sub-well region is embedded in the surface of the substrate and ends without reaching a well region of the gate electrode which is of the first conductivity type.

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patent: 5874768 (1999-02-01), Yamaguchi et al.
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patent: 6320234 (2001-11-01), Karasawa et al.
patent: 6646311 (2003-11-01), Chatterjee
Japanese Abstract, 58070572, Publication Date Apr. 27, 1983.
Japanese Abstract, 01074760, Publication Date Mar. 20, 1989.
Japanese Abstract, 01293565, Publication Date Nov. 27, 1989.
Japanese Abstract, 08181218 A, Publication Date Jul. 12, 1996.
Yoshida, “Highly Efficient UHF-Band Si Power MOSFET for RF Powers Amplifiers”, Electronics and Communications in Japan, Part 2. vol. 77. No. 4. 1994. pp. 10-19.
Yoshida, “2-GHz Si Power Mosfet Technology”, pp. 3.1.1-3.1.4.

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