Semiconductor chip with test pads and tape carrier package...

Details Semiconductor chip with test pads and tape carrier package... Semiconductor chip with test pads and tape carrier package...

2007-07-03

2007-07-03

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S730000, C257S735000, C438S015000

Reexamination Certificate

active

10801501

ABSTRACT:
A semiconductor chip with test pads and a tape carrier package using the same are provided. The tape carrier package comprises a semiconductor chip. The semiconductor chip has an active surface and a back surface. The active surface has a main circuit area having integrated circuits and a peripheral area having chip pads connected to the integrated circuits. The semiconductor chip has test pads connected to the chip pads for testing the characteristics of the integrated circuits. The tape carrier package further comprises a tape wiring substrate having an insulating base film, wiring patterns formed on the insulating base film, leads formed integrally with the wiring patterns and dummy leads electrically isolated from the wiring patterns, and bumps connecting the chip pads to the corresponding leads and the test pads to the dummy leads.

REFERENCES:
patent: 6127729 (2000-10-01), Fukuda
patent: 6861665 (2005-03-01), Kim
patent: 05-021514 (1993-01-01), None
patent: 06-120313 (1994-04-01), None
patent: 2001-358305 (2001-12-01), None
patent: 2002-303653 (2002-10-01), None
patent: 1020020030140 (2002-04-01), None
English language abstract of Korean Publication No. 1020020030140.
English language abstract of Japanese Publication No. 06-120313.
English language abstract of Japanese Publication No. 05-021514.
English language abstract of Japanese Publication No. 2001-358305.
English language abstract of Korean Publication No. 2002-303653.

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