4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Mohammad Khan

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active

Boat for organic and ceramic flip chip package assembly

Supports: racks – Special article – Platelike
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Integrated circuit package lid with a wetting film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Methods, systems and computer program products for over the...

Telecommunications – Transmitter and receiver at same station – Radiotelephone equipment detail
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Power supply to xenon ARC lamp interface

Electric lamp and discharge devices: systems – With electromagnetic wave radiation preventing or shielding...
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Reduction of damage to thermal interface material due to...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
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Profile ID: LFUS-PAI-P-2050130

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