Semiconductor chip singulation method

Details Semiconductor chip singulation method Semiconductor chip singulation method

2006-08-29

2006-08-29

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S114000, C438S907000

Reexamination Certificate

active

07098077

ABSTRACT:
A method to singulate a circuit die from an integrated circuit wafer is achieved. The method comprises providing an integrated circuit wafer containing a circuit die. The integrated circuit wafer is cut through by performing a single, continuous cut around the perimeter of the circuit die to thereby singulate the circuit die.

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