Semiconductor chip package having chip-to-carrier mechanical/ele

Details Semiconductor chip package having chip-to-carrier mechanical/ele Semiconductor chip package having chip-to-carrier mechanical/ele

1995-06-06

2000-10-10

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257737, 257738, 257666, 257668, 257700, 257778, H01L 23495, H01L 2312, H01L 2353, H01L 2348

Patent

active

06130476&

ABSTRACT:
A method for joining a semiconductor integrated circuit chip in a flip chip configuration, via solder balls, to solderable metal contact pads, leads or circuit lines on the circuitized surface of an organic chip carrier substrate, as well as the resulting chip package, are disclosed. The inventive method does not require the use of a solder mask, does not require the melting of the bulk of any of the solder balls and does not require the use of a fluxing agent.

REFERENCES:
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 4332341 (1982-06-01), Minetti
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5276955 (1994-01-01), Noddin et al.
patent: 5470787 (1995-11-01), Greer

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