Semiconductor chip mounting sector

Details Semiconductor chip mounting sector Semiconductor chip mounting sector

1995-03-23

1996-10-01

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257691, 257717, 361713, 361718, H01L 2334, H01L 2352

Patent

active

055613241

ABSTRACT:
The present invention relates to a semiconductor device which comprises a semiconductor chip mounting section having a through hole, a radiating plate attached to one surface of the semiconductor chip mounting section so as to cover the through hole of the semiconductor chip mounting section, a semiconductor chip mounting plate which is formed within the through hole and mounted on the radiating plate, a surface of the semiconductor chip mounting plate, which is opposite to another surface thereof mounted on the radiating plate, being plated with gold, and the semiconductor chip mounting plate having improved electrical insulation properties and high thermal conductivity, and a semiconductor chip formed within the through hole and attached to the semiconductor chip mounting plate by a conductive adhesive.

REFERENCES:
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4688077 (1987-08-01), Wakabayashi et al.
patent: 4876588 (1989-10-01), Miyamoto
patent: 4901137 (1990-02-01), Sato et al.
patent: 4914551 (1990-04-01), Anschel et al.
patent: 5184211 (1993-02-01), Fox

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