Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-03-31
2008-09-30
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S730000, C257S784000, C257S787000, C257SE25006, C257SE25013, C361S736000, C361S748000, C361S772000, C438S107000, C438S118000, C438S125000, C438S126000, C438S617000
Reexamination Certificate
active
07429787
ABSTRACT:
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the molding of the first package with the first side of the second substrate facing the die attach side of the first package substrate. Z-interconnection of the package and the substrate is by wire bonds connecting the first and second substrates. The assembly is encapsulated with both the land side of the second substrate and a portion of the land side of the first package substrate exposed, so that second level interconnection and interconnection with additional components may be made.
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Chow Seng Guan
Han Byung Joon
Karnezos Marcos
Ramakrishna Kambhampati
Shim IL Kwon
Chambliss Alonzo
Stats Chippac Ltd.
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