Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2006-03-07
2006-03-07
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S717000, C257S718000
Reexamination Certificate
active
07009284
ABSTRACT:
A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitting of the substrate unit is performed by a second radiation block which is screwed to push the first radiation block toward the cooling block. A high thermal-conductive radiation material is disposed at the interfaces between each of the insulation substrates and each of the blocks to keep adhesiveness therebetween.
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Electronic Technology May 1999, pp. 56-59.
Migitaka Yukinori
Nakase Yoshimi
Teshima Takanori
DENSO Corporation
Harness Dickey & Pierce PLC
Nguyen Dilinh
Pham Hoai
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