Semi-conductor device

Details Semi-conductor device Semi-conductor device

1989-11-28

1991-05-21

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 81, 361381, 361383, H01L 2302, H01L 2312, H01L 3902

Patent

active

050180045

ABSTRACT:
A semiconductor chip package technology which uses thin film wiring from the chip to the package terminals for increased line density and decreased parasitic capacitance and uses a thin film adhesion layer for improved heat conductivity between the package substrate and its sealing cap. The package uses a thin conductor film deposited along the element mounting surface of a sintered substrate. An adhesion layer, to provide a high quality bond between the sealing cap and substrate, is then deposited on the substrate peripheral area by successively laminating metal and metallized layers, or by depositing a single layer of low metal glass. The adhesion layer is thinner and of larger area than thick film technology, for improved heat conduction.

REFERENCES:
patent: 4561010 (1985-12-01), Ogihara et al.
patent: 4769690 (1988-09-01), Suzuki et al.
patent: 4868638 (1989-09-01), Hirata et al.

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