Self-aligned silicidation technique to independently form silici

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438233, 438592, 438759, H01L 21336

Patent

active

059536128

ABSTRACT:
A technique for self-aligned silicidation of semiconductor devices is disclosed. This technique includes the formation of polysilicon device features extending from a semiconductor substrate. A coating is deposited on the features and substrate. Chemical mechanical polishing is performed to remove a portion of the coating to expose a polysilicon surface of the features. A metallic layer is formed to contact the exposed polysilicon surface of each of the features. A silicide layer is formed for each feature from the polysilicon and the metallic layer in contact therewith.

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