Self-aligned planar double-gate transistor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S365000, C257S366000, C257S368000, C257SE27112, C257SE29264, C257SE29275

Reexamination Certificate

active

07960790

ABSTRACT:
A double-gate transistor having front (upper) and back gates that are aligned laterally is provided. The double-gate transistor includes a back gate thermal oxide layer below a device layer; a back gate electrode below a back gate thermal oxide layer; a front gate thermal oxide above the device layer; a front gate electrode layer above the front gate thermal oxide and vertically aligned with the back gate electrode; and a transistor body disposed above the back gate thermal oxide layer, symmetric with the first gate. The back gate electrode has a layer of oxide formed below the transistor body and on either side of a central portion of the back gate electrode, thereby positioning the back gate self-aligned with the front gate. The transistor also includes source and drain electrodes on opposite sides of said transistor body.

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