Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-03-22
2005-03-22
Vu, Hung (Department: 2811)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
Reexamination Certificate
active
06869850
ABSTRACT:
In one embodiment, a transistor comprises raised structures over a source region and a drain region. The raised source structures may comprise selectively deposited metal, such as selective tungsten. A self-aligned contact structure formed through a dielectric layer may provide an electrical connection between an overlying structure (e.g., an interconnect line) and the source or drain region. The transistor may further comprise a gate stack having a capping layer over a metal.
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Chang, Hsiao-Yung “Modeling and Simulation of a Tungten Chemical Vapor Deposition Reactor” Aug. 1, 2000 (Abstract) pp. 1-154, University of Maryland, College Park.
Kobayashi, Nobuyoshi, et al. “Study on mechanism of selective chemical vapor deposition of tungsten using in situ infrared spectroscopy and Auger electron spectroscopy”, 1991, pp. 1013-1019, vol. 69, No. 2, Journal of Applied Physics; Japan.
Blosse Alain
Ramkumar Krishnaswamy
Cypress Semiconductor Corporation
Okamoto & Benedicto LLP
Vu Hung
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