Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2007-03-13
2007-03-13
Deo, Duy-Vu N. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S719000, C438S720000
Reexamination Certificate
active
10313048
ABSTRACT:
A method of forming a semiconductor structure comprises oxidizing a stack, to form sidewall oxide in contact with sides of the stack. The stack is on a semiconductor substrate, the stack includes a gate layer, comprising silicon; a metallic layer, on the gate layer; and an etch-stop layer, on the metallic layer. The sidewall oxide in contact with the metallic layer is thinner than the sidewall oxide in contact with the gate layer.
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Blosse Alain
Narayanan Sundar
Ramkumar Krishnaswamy
Cypress Semiconductor Corporation
Deo Duy-Vu N.
Evan Law Group LLC
Tran Binh X
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