Selective metallization process

Details Selective metallization process Selective metallization process

1990-11-01

1992-10-27

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430319, 430328, 427304, 427305, G03C 558

Patent

active

051588609

ABSTRACT:
A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

REFERENCES:
patent: 4388351 (1983-06-01), Sawyer
patent: 4526810 (1985-07-01), Nesbitt
patent: 4748104 (1988-05-01), Ferrier et al.
patent: 4827326 (1989-05-01), Altman et al.
patent: 4906552 (1990-03-01), Ngo et al.
patent: 4981715 (1991-01-01), Hirsch et al.

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