Selective etching process

Details Selective etching process Selective etching process

1991-12-23

1994-09-20

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156657, 156662, 252 791, 437225, 437228, H01L 2100

Patent

active

053486170

ABSTRACT:
A process for selectively etching silicon comprises preparing a solution of etchant which is a non-selective etch for at least silicon and aluminum. The prepared solution is preconditioned by adding atomic silicon to the solution and aging the solution after the addition of silicon for at least 30 minutes. Then, silicon substrates carrying aluminum are immersed in the preconditioned solution to etch the silicon while leaving the aluminum substantially unaffected.

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