Method for patterning a mold

Details Method for patterning a mold Method for patterning a mold

1993-05-03

1994-09-20

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156654, 1566591, 156905, B44C 122, C23F 100

Patent

active

053486161

ABSTRACT:
A mold substrate having a major surface is provided. A patterned masking layer is formed on the major surface of the mold substrate that exposes portions of the major surface of the mold substrate while other portions are covered by the patterned masking layer. The major surface of the mold substrate is etched, thereby removing exposed portions of the major surface of the mold substrate, and thus transferring the pattern from the patterned masking layer to the major surface of the mold substrate.

REFERENCES:
patent: 4321105 (1982-03-01), Melonio et al.
patent: 4437924 (1984-03-01), Weglin
patent: 4582566 (1986-04-01), Grey
Toshio Yuhta et al. Bull. Japan Soc. of Prec. Engg., vol. 17, Mar. 1983.

Affiliated with

Also associated with

Rating

Method for patterning a mold does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for patterning a mold, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for patterning a mold will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2429549