Sealed polishing pad methods

Details Sealed polishing pad methods Sealed polishing pad methods

2006-09-26

2006-09-26

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S533000, C051S307000

Reexamination Certificate

active

07112119

ABSTRACT:
A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.

REFERENCES:
patent: 5081796 (1992-01-01), Schultz
patent: 5605760 (1997-02-01), Roberts
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6217410 (2001-04-01), Holzapfel et al.
patent: 6599765 (2003-07-01), Boyd et al.
patent: 6620036 (2003-09-01), Freeman et al.
patent: 6621264 (2003-09-01), Lehman et al.
patent: 6719818 (2004-04-01), Birang et al.
patent: 2004/0248501 (2004-12-01), Kim et al.
patent: 2005/0090105 (2005-04-01), Elledge
patent: 2005/0266771 (2005-12-01), Wiswesser

Affiliated with

Also associated with

Rating

Sealed polishing pad methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sealed polishing pad methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sealed polishing pad methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3603740