Scalable MOS field effect transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S382000, C257S330000

Reexamination Certificate

active

06870232

ABSTRACT:
A field effect transistor and method for making is described incorporating self aligned source and drain contacts with Schottky metal-to-semiconductor junction and a T-shaped gate or incorporating highly doped semiconductor material for the source and drain contacts different from the channel material to provide etch selectivity and a T-shaped gate or incorporating a metal for the source and drain contacts and the oxide of the metal for the gate dielectric which is self aligned.

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A. Acovic et al., “Novel Gate Process for 0.1 Micron MOSFETs”, IBM Technical Disclosure Bulletin, vol. 36, No. 11, Nov. 1993.
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