Salicide process utilizing a cluster ion implantation process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S672000, C438S673000, C438S692000, C438S723000, C438S724000, C257SE21165, C257SE21169, C257SE21315, C257SE21438, C257SE21585

Reexamination Certificate

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07553763

ABSTRACT:
A salicide process contains providing a silicon substrate that comprises at least a predetermined salicide region, performing a cluster ion implantation process to form an amorphized layer in the predetermined salicide region of the silicon substrate near, forming a metal layer on the surface of the amorphized layer, and reacting the metal layer with the amorphized layer to form a silicide layer on the surface of the silicon substrate.

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patent: 2007/0246832 (2007-10-01), Odagawa et al.

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