RRAM memory cell electrodes

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S044000, C257S192000, C257S310000, C360S324000, C360S326000

Reexamination Certificate

active

06849891

ABSTRACT:
A RRAM memory cell is formed on a silicon substrate having a operative junction therein and a metal plug formed thereon, includes a first oxidation resistive layer; a first refractory metal layer; a CMR layer; a second refractory metal layer; and a second oxidation resistive layer. A method of fabricating a multi-layer electrode RRAM memory cell includes preparing a silicon substrate; forming a junction in the substrate taken from the group of junctions consisting of N+ junctions and P+ junctions; depositing a metal plug on the junction; depositing a first oxidation resistant layer on the metal plug; depositing a first refractory metal layer on the first oxidation resistant layer; depositing a CMR layer on the first refractory metal layer; depositing a second refractory metal layer on the CMR layer; depositing a second oxidation resistant layer on the second refractory metal layer; and completing the RRAM memory cell.

REFERENCES:
patent: 5504041 (1996-04-01), Summerfelt
patent: 6723643 (2004-04-01), Pan et al.
Liu et al.,Electrical-pulse-induced reversible resistance change effect in magnetoresistive filmsApplied Physics Letters. vol. 76, #19, p. 2749-2751; May, 2000.

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