Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate
2005-12-29
2010-10-05
Duverne, Jean F (Department: 2839)
Electrical connectors
With insulation other than conductor sheath
Plural-contact coupling part
Reexamination Certificate
active
07806731
ABSTRACT:
A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.
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Chen Han-Shiao
Chiu Chin-Tien
Liao Chih-Chin
Takiar Hem
Wang Ken Jian Ming
Duverne Jean F
SanDisk Corporation
Vierra Magen Marcus & DeNiro LLP
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