4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Ken Jian Ming Wang

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Integrated circuit package with etched leadframe for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Lead frame-BGA package with enhanced thermal performance and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Padless substrate for surface mounted components

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Printed circuit board with coextensive electrical connectors...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Rounded contact fingers on substrate/PCB for crack prevention

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
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Profile ID: LFUS-PAI-P-2322031

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