Rotational thermophoretic drying

Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment

Reexamination Certificate

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Details

C134S034000, C134S035000, C134S036000

Reexamination Certificate

active

07011715

ABSTRACT:
A method that includes rotating a wafer, heating the wafer, applying a first liquid through one or more nozzles to a center of a topside of the wafer that is cooler than the heated wafer, and translating the one or more nozzles to an outer diameter edge of the wafer.

REFERENCES:
patent: 5882433 (1999-03-01), Ueno
patent: 6221168 (2001-04-01), Carter et al.
patent: 6398975 (2002-06-01), Mertens et al.
patent: 6406551 (2002-06-01), Nelson et al.
patent: 6491764 (2002-12-01), Mertens et al.

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