Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Patent
1999-03-22
2000-06-27
Niebling, John F.
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
438769, 438787, 438789, 438790, 4274432, 427435, H01L 2131
Patent
active
060806834
ABSTRACT:
Disclosed is a room temperature wet chemical growth (RTWCG) process of SiO-based insulator coatings on silicon substrates for electronic and photonic (optoelectronic) device applications. The process includes soaking the Si substrates into the growth solution. The process utilizes a mixture of H.sub.2 SiF.sub.6, N-n-butylpyridinium chloride, redox Fe.sup.2+ /Fe.sup.3+ aqueous solutions, and a homogeneous catalyst.
REFERENCES:
patent: 2505629 (1950-04-01), Thomsen et al.
patent: 4347097 (1982-08-01), Nishizawa
patent: 4431683 (1984-02-01), Sasaki et al.
patent: 4468420 (1984-08-01), Kawahara et al.
patent: 4693916 (1987-09-01), Nagayama et al.
patent: 5073408 (1991-12-01), Goda et al.
patent: 5132140 (1992-07-01), Goda et al.
patent: 5429995 (1995-07-01), Nishiyama et al.
patent: 5492859 (1996-02-01), Sakaguchi et al.
patent: 5506006 (1996-04-01), Chou et al.
patent: 5536361 (1996-07-01), Kondo et al.
patent: 5616233 (1997-04-01), Jenn-Gwo et al.
patent: 5646440 (1997-07-01), Hasegawa
patent: 5648128 (1997-07-01), Yah et al.
patent: 5659192 (1997-08-01), Sarama et al.
patent: 5661092 (1997-08-01), Koberstein et al.
patent: 5674356 (1997-10-01), Nagayama
patent: 5703404 (1997-12-01), Matsuura
"A New Process for Silica Coating", Hirotsugu Nagayama, Hisao Honda, and Hideo Kawahara, J. Electrochem. Soc.: Solid-State Science and Technology, Aug. 1988, pp. 2013-2016.
"A Selective SiO.sub.2 Film-Formation Technology Using Liquid-Phase Deposition for Fully Planarized Multilevel Interconnections", Tetsuya Homma, Takuya Katoh, Yoshiaki Yamada, and Yukinobu Murao, J. Electrochecm. Soc., vol. 140, No. 8, Aug. 1993, pp. 2410-2414.
"The Initial Growth Mechanism of Silicon Oxide by Liquid-Phase Deposition", Jenq-Shiuh Chou and Si-Chen Lee, J. Electrochem. Soc., vol. 141, No. 11, Nov. 1994, pp. 3214-3218.
"The Physicochemical Properties and Growth Mechanism of Oxide (SiO.sub.2-x F.sub.x) by Liquid Phase Deposition with H.sub.2 O Addition Only", Ching-Fa Yeh, Chun-Lin Chen, and Guan-Hong Lin, J. Electrochem. Soc., vol. 141, No. 11, Nov. 1994, pp. 3177-3181.
"Low-Temperature Processed MOSFET's with Liquid Phase Deposited SiO.sub.2-x F.sub.X as Gate Insulator", Ching-Fa Yeh, Shyue-Shyh Lin, and Tzy-Yan Hong, IEEE Electron Device Letters, vol. 16, No. 7, Jul. 1995, pp. 316-318.
"Photoassisted Liquid-Phase Deposition of Silicon Dioxide", Chen-Tang Huang, Peng-Heng Chang, and Jin-Shown Shie, J. Electrochem. Soc., vol. 143, No. 6, Jun. 1996, pp. 2044-2048.
Bailey Sheila G.
Faur Horia M.
Faur Maria
Faur Mircea
Flood Dennis J.
Ghyka Alexander G.
Niebling John F.
Special Materials Research and Technology, Inc.
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