Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-12-30
1999-12-07
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257787, 528 10, 526238, H01L 2348
Patent
active
059988762
ABSTRACT:
The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A).sub.n RB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof.
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Buchwalter Stephen Leslie
Carter Kenneth Raymond
Gaynes Michael Anthony
Hawker Craig Jon
Hedrick James Lupton
Gresens John J.
International Business Machines - Corporation
Jr. Carl Whitehead
Martin Robert B.
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