Reverse CMOS method for dual isolation semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438221, 438224, 438225, 438233, 438296, 438430, 438621, 438638, 438648, 438656, H01L 218238

Patent

active

058743286

ABSTRACT:
CMOS transistors are formed by a damascene process resulting in field oxide regions exhibiting essentially no bird's beak portions. A trench isolation is also formed in a source/drain region each transistor between adjacent junctions.

REFERENCES:
patent: 4764484 (1988-08-01), Mo
patent: 4927777 (1990-05-01), Hsu et al.
patent: 4980306 (1990-12-01), Shimbo
patent: 5015594 (1991-05-01), Chu et al.
patent: 5055423 (1991-10-01), Smith et al.
patent: 5573969 (1996-11-01), Kim

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reverse CMOS method for dual isolation semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reverse CMOS method for dual isolation semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reverse CMOS method for dual isolation semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-306396

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.