Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-06-30
1999-02-23
Trinh, Michael
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438221, 438224, 438225, 438233, 438296, 438430, 438621, 438638, 438648, 438656, H01L 218238
Patent
active
058743286
ABSTRACT:
CMOS transistors are formed by a damascene process resulting in field oxide regions exhibiting essentially no bird's beak portions. A trench isolation is also formed in a source/drain region each transistor between adjacent junctions.
REFERENCES:
patent: 4764484 (1988-08-01), Mo
patent: 4927777 (1990-05-01), Hsu et al.
patent: 4980306 (1990-12-01), Shimbo
patent: 5015594 (1991-05-01), Chu et al.
patent: 5055423 (1991-10-01), Smith et al.
patent: 5573969 (1996-11-01), Kim
Chang Kuang-Yeh
Liu Yowjuang W.
Advanced Micro Devices , Inc.
Pham Long
Trinh Michael
LandOfFree
Reverse CMOS method for dual isolation semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reverse CMOS method for dual isolation semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reverse CMOS method for dual isolation semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-306396