Restoring low dielectric constant film properties

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S787000, C438S758000, C438S781000, C438S478000

Reexamination Certificate

active

08058183

ABSTRACT:
A method for restoring the dielectric constant of a low dielectric constant film is described. A porous dielectric layer having a plurality of pores is formed on a substrate. The plurality of pores is then filled with an additive to provide a plugged porous dielectric layer. Finally, the additive is removed from the plurality of pores.

REFERENCES:
patent: 6703324 (2004-03-01), Wong
patent: 7094681 (2006-08-01), Fujita et al.

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