Resists and method of manufacturing semiconductor elements by us

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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427 431, 430280, 430281, 430296, 430297, 430313, 430317, 430318, 430326, 430328, 430330, 430942, G03C 500

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042787548

ABSTRACT:
A resist utilized to prepare semiconductor elements or the like comprises a copolymer of, for example, 2,3 dibromo-n-propyl methacrylate and methylmethacrylate. The resist is applied onto a substrate to form a copolymer resist layer, the copolymer resist layer is irradiated with ionizing radiations, the irradiated portions of the copolymer resist layer are dissolved to form a positive pattern, the positive pattern is heated in inert atmosphere to cause crosslinking reaction of reactive radicals remaining in the copolymer resist, and then the assembly is etched with a liquid etchant to form an etched pattern on the substrate. Alternatively, the positive pattern and the underlying substrate are treated with plasma or ions to cause a crosslinking reaction of reactive radicals remaining in the copolymer resist to simultaneously etch portions of the substrate not covered by the positive pattern.

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patent: 3996393 (1976-12-01), Cortellino et al.
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patent: 4090936 (1978-05-01), Barton
patent: 4096290 (1978-06-01), Fredericks
patent: 4125672 (1978-11-01), Kakuchi et al.

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