Resistive load for integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257538, 257755, 257904, H01L 21768, H01L 2352

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active

055942695

ABSTRACT:
An integrated circuit structure contains both highly resistive regions and highly conductive interconnect regions in a single layer of polycrystalline silicon. The resistive regions have a smaller cross section than the interconnect regions as a result of partial oxidation. Their thickness and width are reduced from that of the interconnect regions. The partial oxidation leaves an oxide region, derived from polycrystalline silicon, on both the top and sides of the resistive regions.

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Patent Abstracts of Japan, Kokai #63 098145, Toshiaki et al. Pub. Apr. 1988, vol. 012335, Abst. Pub. Sep. 1988, 1 sheet.

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