Resist pattern and reflow technology

Details Resist pattern and reflow technology Resist pattern and reflow technology

2008-05-13

2008-05-13

Huff, Mark F. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S311000

Reexamination Certificate

active

10840647

ABSTRACT:
A reflow stabilizing solution for treating photoresist patterns and a reflow technology are disclosed. The reflow stabilizing solution comprises a polymer and is applied after the photoresist material has been developed and patterned. By treating the photoresist with the reflow stabilizing solution after resist patterning and further subjecting the reflow stabilizing solution to a heat treatment, the non-volatile polymer remains in between adjacent resist patterns and acts as a stopper to the reflowed photoresist. In this manner, the non-volatile polymer provides structural and mechanical support for the reflowed resist, preventing resist collapse at high temperatures and allowing the formation of reflowed resist structures having line width dimensions in the submicron range.

REFERENCES:
patent: 4022932 (1977-05-01), Feng
patent: 5552342 (1996-09-01), Itou et al.
patent: 5960315 (1999-09-01), Gambino et al.
patent: 6486058 (2002-11-01), Chun

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