Resist material for use in thick film resists

Details Resist material for use in thick film resists Resist material for use in thick film resists

1992-03-10

1993-11-16

Rodee, Christopher D.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430324, 430326, 430329, 430328, 430312, G03F 730, G03C 558

Patent

active

052622819

ABSTRACT:
Excellent resolution and sensitivity in the patterning of resists utilized in device and mask manufacture is obtained with a specific composition. In particular this composition involves polymers having recurring pendant acid labile .alpha.-alkoxyalkyl carboxylic acid ester and/or hydroxyaromatic ether moieties in the presence of a substance that is an acid generator upon exposure to actinic radiation.

REFERENCES:
patent: 3779778 (1973-12-01), Smith et al.
patent: 4356252 (1982-10-01), Lee
patent: 4491628 (1985-01-01), Ito et al.
patent: 4985332 (1991-01-01), Anderson et al.
patent: 5071731 (1991-12-01), Chen et al.
patent: 5072029 (1991-12-01), Hertler
patent: 5077174 (1991-12-01), Bauer et al.
patent: 5145764 (1992-09-01), Bauer et al.
Printed Circuits Handbook, Second Edition, Chap. 6, (1979).
Photoresist Materials and Processes, W. S. DeForest (1975).
J. E. Dearns et al., J. Macromol. Sci. Chem., A8(4), pp. 673-685 (1974).

Affiliated with

Also associated with

Rating

Resist material for use in thick film resists does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist material for use in thick film resists, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist material for use in thick film resists will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-21535