Resist lower layer material, resist lower layer substrate...

Details Resist lower layer material, resist lower layer substrate... Resist lower layer material, resist lower layer substrate...

2011-01-18

2011-01-18

Kelly, Cynthia H (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S271100, C430S272100, C430S276100, C430S919000, C430S925000

Reexamination Certificate

active

07871761

ABSTRACT:
Provided is a method for forming a resist lower layer material for use in a multilayer resist process, especially two-layer resist process or three-layer resist process, having a function of neutralizing an amine contaminant from a substrate, thereby reducing a harmful effect such as trailing skirts of a resist pattern of an upper layer resist. Specifically, there is provided a material for forming a lower layer of a chemically amplified photoresist layer comprising a crosslinkable polymer and a thermal acid generator that can generate an acid by heating at 100° C. or greater and is represented by the general formula (1a):in-line-formulae description="In-line Formulae" end="lead"?R1CF2SO3−(R2)4N+  (1a),in-line-formulae description="In-line Formulae" end="tail"?as well as a resist lower layer substrate comprising a resist lower layer formed using said material.

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