Resist composition, method of forming resist pattern, novel...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S905000, C430S910000, C430S914000, C430S921000, C430S922000, C430S923000, C430S924000, C549S300000, C549S318000, C549S320000, C549S459000, C549S473000

Reexamination Certificate

active

07927780

ABSTRACT:
A compound represented by formula (I); and a compound represented by formula (b1-1):wherein X represents —O—, —S—, —O—R3— or —S—R4—, wherein each of R3and R4independently represents an alkylene group of 1 to 5 carbon atoms; R2represents an alkyl group of 1 to 6 carbon atoms, an alkoxy group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, a halogen atom, a hydroxyalkyl group of 1 to 6 carbon atoms, a hydroxyl group or a cyano group; a represents an integer of 0 to 2; Q1represents an alkylene group of 1 to 12 carbon atoms or a single bond; Y1represents an alkylene group of 1 to 4 carbon atoms or a fluorinated alkylene group; M+represents an alkali metal ion; and A+represents an organic cation.

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Notice of Allowance issued in counterpart Korean Patent Application No. 10-2008-0088820, dated Mar. 30, 2010.
Notice of Allowance issued in counterpart Korean Patent Application No. 10-2008-0088820, dated Mar. 30, 2010.

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