Resist composition, method of forming resist pattern,...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S326000, C430S905000, C430S910000, C430S922000

Reexamination Certificate

active

07488568

ABSTRACT:
A resist composition including a base component (A) and an acid-generator component (B), the acid-generator component (B) including an acid generator (B1) including a compound represented by general formula (b1-8) shown below (wherein R401represents an acid dissociable, dissolution inhibiting group; R41to R43each independently represents a halogen atom, a halogenated alkyl group, an alkyl group, an acetyl group, an alkoxy group, a carboxy group or a hydroxyalkyl group; Q represents a divalent linking group or a single bond; and X−represents an anion) or an acid generator (B1′) including a compound represented by general formula (b1-9) shown below (wherein R402and R403each independently represents a hydrogen atom, an alkyl group or a halogenated alkyl group; R404represents an alkyl group or a halogenated alkyl group, wherein R403and R404may be bonded to each other to form a ring structure; and X−represents an anion).

REFERENCES:
patent: 5908730 (1999-06-01), Nitta et al.
patent: 5945517 (1999-08-01), Nitta et al.
patent: 6153733 (2000-11-01), Yukawa et al.
patent: 6180313 (2001-01-01), Yukawa et al.
patent: 7230121 (2007-06-01), Norcini et al.
patent: 2004/0110085 (2004-06-01), Iwai et al.
patent: 2005/0095535 (2005-05-01), Iwai et al.
patent: 2006/0127806 (2006-06-01), Iwai et al.
patent: 2006/0127807 (2006-06-01), Iwai et al.
patent: 2006/0127808 (2006-06-01), Iwai et al.
patent: 2006/0134552 (2006-06-01), Iwai et al.
patent: 2006/0134553 (2006-06-01), Iwai et al.
patent: 2006/0246377 (2006-11-01), Yamato et al.
patent: 2007/0190455 (2007-08-01), Iwai et al.
patent: 2007/0224540 (2007-09-01), Kamimura et al.
patent: 2007/0275307 (2007-11-01), Hada et al.
patent: 09-208554 (1997-08-01), None
patent: 2005-37888 (2005-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resist composition, method of forming resist pattern,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist composition, method of forming resist pattern,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist composition, method of forming resist pattern,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4062587

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.