Resin sealed semiconductor devices and a process for manufacturi

Details Resin sealed semiconductor devices and a process for manufacturi Resin sealed semiconductor devices and a process for manufacturi

1997-08-20

2000-08-01

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257788, 257789, H01L 2328

Patent

active

060971002

ABSTRACT:
A resin encapsulated semiconductor element is encapsulated with resin composition containing an organic compound selected from the group consisting of organobromine compounds, organophosphorus compounds and organonitrogen compounds, an inorganic filler, and a metal borate. The obtained resin encapsulated semiconductor element has the same flame resistance as a conventional semiconductor element which is encapsulated with a resin composition containing a halogen and antimony compound, and furthermore, has remarkably improved reliabilities regarding moisture resistance and storing at a high temperature by effects of the contained metal borate for suppressing generation of or trapping released gas components, such as halogen or phosphorus, and others.

REFERENCES:
patent: 5726391 (1998-03-01), Iyer et al.
patent: 5880179 (1999-03-01), Ito et al.

Affiliated with

Also associated with

Rating

Resin sealed semiconductor devices and a process for manufacturi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin sealed semiconductor devices and a process for manufacturi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealed semiconductor devices and a process for manufacturi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-666852