4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Masahiro Ishitsuka

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active

Die bonding device and semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate

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Resin-molded semiconductor device and lead frame employed for fa

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor device, and a manufacturing apparatus for a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-809615

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