Resin mold material and resin mold

Details Resin mold material and resin mold Resin mold material and resin mold

2007-10-30

2007-10-30

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Shaping or casting surface

C249S141000, C425S812000

Reexamination Certificate

active

10855210

ABSTRACT:
A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 μm; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.

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