4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Takaki Kuno

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Composite material and resin mold

Static molds – Including coating or adherent layer – Parting layer
Reexamination Certificate

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Conductive porous material, resin molding die employing the...

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Reexamination Certificate

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Low-adhesion material, resin molding die, and soil resistant...

Stock material or miscellaneous articles – Composite – Of inorganic material
Reexamination Certificate

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Method of evaluating adhesion property, low-adhesion...

Measuring and testing – Coating material: ink adhesive and/or plastic
Reexamination Certificate

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Method of resin sealing a gap between a semiconductor chip...

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Producing multilayer work or article
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Profile ID: LFUS-PAI-P-1710139

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