4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Towa Corporation

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Apparatus for molding resin to seal electronic parts

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent

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Composite material and resin mold

Static molds – Including coating or adherent layer – Parting layer
Reexamination Certificate

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Conductive porous material, resin molding die employing the...

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Reexamination Certificate

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Cutting apparatus

Abrading – Machine – Sandblast
Reexamination Certificate

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Cutting apparatus and cutting method

Abrading – Abrading process
Reexamination Certificate

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Profile ID: LFUS-PAI-P-511764

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