Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate
Reexamination Certificate
2006-07-18
2006-07-18
Blum, David S. (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having schottky gate
Reexamination Certificate
active
07078282
ABSTRACT:
The present invention relates to the deposition of a layer above a transistor structure, causing crystalline stress within the transistor, and resulting in increased performance. The stress layer may be formed above a plurality of transistors formed on a substrate, or above a plurality of selected transistors.
REFERENCES:
patent: 4352724 (1982-10-01), Sugishima et al.
patent: 5960270 (1999-09-01), Misra et al.
patent: 6015727 (2000-01-01), Wanlass
patent: 6071784 (2000-06-01), Mehta et al.
patent: 6146954 (2000-11-01), Klein et al.
patent: 6475908 (2002-11-01), Lin et al.
patent: 6660598 (2003-12-01), Hanafi et al.
patent: 6677652 (2004-01-01), Lin et al.
patent: 6686630 (2004-02-01), Hanafi et al.
patent: 6841831 (2005-01-01), Hanafi et al.
patent: 6858502 (2005-02-01), Chu et al.
patent: 6861350 (2005-03-01), Ngo et al.
patent: 2002/0094647 (2002-07-01), Woerlee et al.
patent: 2003/0011023 (2003-01-01), Hurley
patent: 2003/0215999 (2003-11-01), Chern et al.
International Search Report PCT/US2004/044077.
Barns Chris E.
Brask Justin K.
Chau Robert S.
Hareland Scott A.
Blakely , Sokoloff, Taylor & Zafman LLP
Blum David S.
Intel Corporation
LandOfFree
Replacement gate flow facilitating high yield and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Replacement gate flow facilitating high yield and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Replacement gate flow facilitating high yield and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3589178