Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...
Reexamination Certificate
2005-02-01
2005-02-01
Olsen, Allan (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With means for passing discrete workpiece through plural...
C156S345350, C156S345540, C134S061000, C134S063000, C134S093000, C134S902000
Reexamination Certificate
active
06849153
ABSTRACT:
A method for removal of post reactive ion etch sidewall polymer rails on a Al/Cu metal line of a semiconductor or microelectronic composite structure comprising:1) supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber in which said composite structure is supported to form a water soluble material of sidewall polymer rails left behind on the Al/Cu metal line from the RIE process; removing the water soluble material with deionized water; and removing photo-resist from said composite structure by either a water-only plasma process or a chemical down stream etching method; or2) forming a water-only plasma process to strip the photo-resist layer of a semiconductor or microelectronic composite structure previously subjected to a RIE process;supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber on which said structure is supported to form a water soluble material of saidwall polymer rails left behind on the Al/Cu metal line from the RIE process; andremoving the water soluble material with deionized water.
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Akatsu Hiroyuki
Gutsche Martin
Natzle Wesley
Ramachandran Ravikumar
Yu Chien
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