4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including contaminant removal or mitigation

Thomas F. Marinis

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Coplanar mounting member for a MEM sensor

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Isolation by pn junction only
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Integrated packaging of micromechanical sensors and...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
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Integrated sensor and electronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
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Method and apparatus for sealing a chip carrier and lid

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Method and apparatus for sealing a chip carrier and lid

Metal fusion bonding – With means to juxtapose and bond plural workpieces
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Profile ID: LFUS-PAI-P-2041631

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