Removable optical monitoring system for chemical mechanical...

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S008000, C451S288000

Reexamination Certificate

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07931522

ABSTRACT:
A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monitoring module located in the cavity, the monitoring module including a light source and a detector, an optical head removably mounted in the recess in the top surface platen, and an optical fiber having a proximate end coupled to the monitoring module and a distal end held by the optical head holding the distal end of the optical fiber in a position to direct light through a window in the polishing pad to the surface of the substrate and receive reflected light from the surface of the substrate.

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Chinese First Office Action, Application No. 200810175050.8, dated Nov. 24, 2009, 11 pages.

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