Reducing polishing pad deformation

Details Reducing polishing pad deformation Reducing polishing pad deformation

2008-04-08

2008-04-08

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S287000, C451S526000

Reexamination Certificate

active

11124420

ABSTRACT:
A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path is provided with an opening to the cavity.

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U.S. Appl. No. 11/213,623, filed Aug. 26, 2005.

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