Reducing polishing pad deformation

Details Reducing polishing pad deformation Reducing polishing pad deformation

2008-04-08

2008-04-08

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S287000, C451S526000

Reexamination Certificate

active

07354334

ABSTRACT:
A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path is provided with an opening to the cavity.

REFERENCES:
patent: 5893796 (1999-04-01), Birang et al.
patent: 5913713 (1999-06-01), Cheek et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6071178 (2000-06-01), Baker, III
patent: 6217426 (2001-04-01), Tolles et al.
patent: 6220942 (2001-04-01), Tolles et al.
patent: 6244935 (2001-06-01), Birang et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6575825 (2003-06-01), Tolles et al.
patent: 6599765 (2003-07-01), Boyd et al.
patent: 6620036 (2003-09-01), Freeman et al.
patent: 6696005 (2004-02-01), Strasbaugh
patent: 6699104 (2004-03-01), Baker et al.
patent: 6855034 (2005-02-01), Hasegawa
patent: 2002/0068516 (2002-06-01), Chen et al.
patent: 2002/0077031 (2002-06-01), Johansson et al.
patent: 2002/0115379 (2002-08-01), Sevilla et al.
patent: 2002/0144372 (2002-10-01), Piombini
patent: 2002/0173231 (2002-11-01), Hasegawa
patent: 2003/0148721 (2003-08-01), Birang et al.
patent: 2003/0181135 (2003-09-01), Liu
patent: 2003/0236055 (2003-12-01), Swedek et al.
patent: 2004/0018809 (2004-01-01), Petroski et al.
U.S. Appl. No. 11/213,623, filed Aug. 26, 2005.

Affiliated with

Also associated with

Rating

Reducing polishing pad deformation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reducing polishing pad deformation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reducing polishing pad deformation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2773587