Reducing particulate contamination during semiconductor device p

Details Reducing particulate contamination during semiconductor device p Reducing particulate contamination during semiconductor device p

1992-11-24

1994-07-12

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 2042983, 20429832, 134 1, H01L 2100

Patent

active

053285557

ABSTRACT:
A process of removing particles from the surface of a substrate to be processed in a vacuum chamber comprising forming a plasma from an inert plasma precursor gas in said chamber, thereby lifting loosely adhered particles from the surface of the substrate, and increasing the flow of said inert gas without increasing the pressure in the vacuum chamber, thereby sweeping the particles beyond the surface of the substrate, where they can be removed by the vacuum chamber exhaust system. Particles having a particle size of about 0.1 micron or larger can be removed in this fashion.

REFERENCES:
patent: 4340462 (1982-07-01), Koch
patent: 5043299 (1991-08-01), Chang et al.
patent: 5244535 (1993-09-01), Ohtsuka et al.
patent: 5248636 (1993-09-01), Davis
Selwyn et al, "In-situ particulate contamination . . . " SPIE Conf. Proc. 1989.
Selwyn et al, "Laser diagnostic techniques . . . " J. Vac. Sci. Technol. A6(3) May/Jun. 1988.

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