Reduced stress sputtering target and method of manufacturing the

Details Reduced stress sputtering target and method of manufacturing the Reduced stress sputtering target and method of manufacturing the

1994-02-22

1995-12-12

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, 228101, C23C 1434

Patent

active

054746671

ABSTRACT:
A sputtering target assembly in which the region of attachment between the sputtering target and the backing plate has varying stiffness, thereby reducing stresses in the target during sputtering. In the region of attachment, the backing plate has varying thickness, for example a smooth taper. Alternatively, the backing plate may include structures which affect the stiffness of the backing plate in the region of attachment. These structures may be defined by machining, molding or forging during manufacture of the backing plate, or by machining or drilling voids in the backing plate. As a second alternative, the bonding material used to attach the sputtering target and the backing plate may have a varying stiffness across the region of attachment.

REFERENCES:
patent: 4855033 (1989-08-01), Hurwitt

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