Ranged fault signatures for fault diagnosis

Details Ranged fault signatures for fault diagnosis Ranged fault signatures for fault diagnosis

2011-04-26

2011-04-26

Beausoliel, Robert (Department: 2113)

Error detection/correction and fault detection/recovery

Data processing system error or fault handling

Reliability and availability

Reexamination Certificate

active

07934125

ABSTRACT:
Process data is analyzed, the process data having been generated during a manufacturing process to detect a fault. One or more process variables of the manufacturing process that contributed to the fault are determined. A relative contribution of each of the one or more process variables to the fault is determined. A fault signature having relative contribution ranges for at least one of the one or more process variables is generated, the relative contribution ranges based on the determined relative contributions.

REFERENCES:
patent: 5442562 (1995-08-01), Hopkins et al.
patent: 5544308 (1996-08-01), Giordano et al.
patent: 5694401 (1997-12-01), Gibson
patent: 6202181 (2001-03-01), Ferguson et al.
patent: 6560736 (2003-05-01), Ferguson et al.
patent: 6615366 (2003-09-01), Grochowski et al.
patent: 6625688 (2003-09-01), Fruehling et al.
patent: 6678569 (2004-01-01), Bunkofske et al.
patent: 6868342 (2005-03-01), Mutter et al.
patent: 6907545 (2005-06-01), Ramadei et al.
patent: 6954883 (2005-10-01), Coss, Jr. et al.
patent: 6954884 (2005-10-01), Dean et al.
patent: 7062411 (2006-06-01), Hopkins et al.
patent: 7072794 (2006-07-01), Wittkowski
patent: 7079677 (2006-07-01), Tai et al.
patent: 7089154 (2006-08-01), Rasmussen et al.
patent: 7151976 (2006-12-01), Lin
patent: 7413546 (2008-08-01), Agutter et al.
patent: 7587296 (2009-09-01), Harvey, Jr. et al.
patent: 7596718 (2009-09-01), Harvey, Jr. et al.
patent: 2002/0143472 (2002-10-01), Mutter et al.
patent: 2003/0109951 (2003-06-01), Hsiung et al.
patent: 2003/0195675 (2003-10-01), Felke et al.
patent: 2003/0225466 (2003-12-01), Yulevitch et al.
patent: 2004/0002842 (2004-01-01), Woessner
patent: 2004/0024543 (2004-02-01), Zhang et al.
patent: 2004/0110310 (2004-06-01), Sun et al.
patent: 2004/0210850 (2004-10-01), Bermudez et al.
patent: 2004/0254762 (2004-12-01), Hopkins et al.
patent: 2005/0010117 (2005-01-01), Agutter et al.
patent: 2005/0060103 (2005-03-01), Chamness
patent: 2005/0114023 (2005-05-01), Williamson et al.
patent: 2005/0114743 (2005-05-01), Moorhouse
patent: 2006/0111804 (2006-05-01), Lin
patent: 2006/0149990 (2006-07-01), S. et al.
patent: 2006/0184264 (2006-08-01), Willis et al.
patent: 2007/0006037 (2007-01-01), Sargusingh et al.
patent: 2007/0021859 (2007-01-01), Lev-Ami et al.
patent: 2007/0028220 (2007-02-01), Miller
patent: 2007/0038418 (2007-02-01), Ahn et al.
patent: 2007/0067678 (2007-03-01), Hosek et al.
patent: 2008/0015726 (2008-01-01), Harvey et al.
patent: 2008/0276128 (2008-11-01), Lin et al.
patent: 2008/0276136 (2008-11-01), Lin et al.
patent: 2008/0276137 (2008-11-01), Lin et al.
patent: 200908186 (2009-02-01), None
patent: 101438249 (2009-05-01), None
patent: WO2007/133543 (2007-11-01), None
patent: WO2008/137062 (2008-11-01), None
Case Study: “Automated Fault Detection and Diagnostic Software”, New Buildings Institute, http://www.archenergy.com/pier-fdd/market—connection/proj7—Deliverables/FDDAlgorithmsCaseStudyFinal.pdf. Apr. 17, 2007, 4 pages.
Chen, Kuanh-Han, et al., “Multivariate Statistical Process Control and Signature Analysis Using Eigenfactor Detection Methods”, 2001, pp. 1-21.
Gallagher, Neal B., et al., “Development and Benchmarking of Multivariate Statistical process Control Tools for a Semiconductor Etch Process: Improving Robustness Through Model Updating”, Eigenvector-Research Inc., Manson, WA, USA, 1997, 6 pages.
Applied Materials, Inc. Notice of Allowance for U.S. Appl. No. 11/800,461 mailed Mar. 3, 2009, (8090P004).
Applied Materials, Inc. Supplemental Notice of Allowability for U.S. Appl. No. 11/800,461 mailed Jun. 1, 2009, (8090P004).
Applied Materials, Inc. Office Action for U.S. Appl. No. 11/800,471 mailed Feb. 3, 2009, (8090P005).
Applied Materials, Inc. Notice of Allowance for U.S. Appl. No. 11/800,471 mailed May 27, 2009, (8090P005).
Applied Materials, Inc. Office Action for U.S. Appl. No. 11/800,462 mailed Apr. 2, 2009, (8090P026).
Applied Materials, Inc. Office Action for U.S. Appl. No. 11/985,603 mailed Apr. 8, 2009, (8090P026C).
Applied Materials, Inc. Office Action for U.S. Appl. No. 11/800,460 mailed Dec. 22, 2009, (8090P003).
Applied Materials, Inc. Notice of Allowance for U.S. Appl. No. 11/800,462 mailed Sep. 24, 2009, (8090P026).
Applied Materials, Inc. Office Action for U.S. Appl. No. 11/985,603 mailed Nov. 20, 2009.
Conlin, A.K., et al., “Confidence Limits for Contribution Plots,” J. Chemometrics 2001, vol. 14, pp. 725-736.
Qin, S. Joe, et al., “On Unifying Multiblock Analysis with Application to Decentralized Process Monitoring,” J. Chemometrics 2001, vol. 15, pp. 715-742.
Westerhuis, Johan A., et al., “Generalized Contribution Plots in Multivariate Statistical Process Monitoring,” Chemometrics and Intelligent Laboratory Systems 2000, vol. 51, pp. 95-114.
Applied Materials, Inc. Office Action for U.S. Appl. No. 11/800,460 mailed Jun. 24, 2010, (8090P003).
Applied Materials, Inc. Notice of Allowance for U.S. Appl. No. 11/985,603 mailed Apr. 6, 2010 (8090P026C).
Office Action for U.S. Appl. No. 11/800,461 mailed Jul. 3, 2008.
Office Action for U.S. Appl. No. 11/800,471 mailed Aug. 5, 2008.
Gallagher, Neal B. et al., “Development and Benchmarking of Multivariate Statistical Process Control Tools for a Semiconductor Etch Process: Improving Robustness Through Model Updating”Eigenvector-Research Inc., Manson, WA, USA, 1997, 8 pages.
Li, W., et al. “Recursive PCA for Adaptive Process Monitoring”, J. Process Control, vol. 10, p. 471-486, 2000.
PCT International Search Report and Written Opinion for International Application No. PCT/US08/05667, mailed Aug. 18, 2008, 10 pages.
PCT International Search Report and Written Opinion for International Application No. PCT/US07/11106, mailed Jul. 14, 2008, 8 pages.
PCT International Search Report and Written Opinion for International Application No. PCT/US07/11142, mailed Jul. 28, 2008, 11 pages.
Spitzlsperger, Gerhard et al. “Fault Detection for a VIA Etch Process Using Adaptive Multivariate Methods” ISSM Tokyo 2004, p. 528-533.

Affiliated with

Also associated with

Rating

Ranged fault signatures for fault diagnosis does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ranged fault signatures for fault diagnosis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ranged fault signatures for fault diagnosis will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2667655